ON Semiconductor announces new Transfer Molded Power Integrated Modules (TM-PIM), NXH50M65L4C2SG and NXH50M65L4C2ESG at APEC 2021, targeted for use in industrial motor drives, servo drives and HVAC where they are used to drive motors for applications including fans and pumps. These modules are based on standard aluminum oxide (AI2O3) substrate and enhanced low thermal resistance substrate respectively. The modules contain a converter−inverter−PFC circuit consisting of single-phase converter with four 75A, 1600V rectifiers, and are ideally suited to rugged industrial applications with high output power. The 3-phase inverter uses six 50 A, 600 V IGBTs with inverse diodes and the dual−channel interleaved PFC comprises two 75 A, 650 V PFC IGBTs with inverse diodes and two 50 A, 650 V PFC diodes. An NTC thermistor is embedded to allow for monitoring of device temperature during operation.
The highly efficient NXH50M65L4C2SG and NXH50M65L4C2ESG are rated at 50A and can be used in applications up to 8kW. As the modules are pre-assembled with an optimized layout and configuration, the parasitic elements are very small when compared to discrete PCB-based designs, allowing a wide PFC switching frequency range of 18kHz to 65kHz.
Available in a compact transfer molded DIP-26 package measuring only 73 mm x 47 mm x 8 mm, it saves space and delivers higher levels of power density. The sealed and robust package also includes a heatsink to provide a high level of corrosion resistance. Moreover, a silicon carbide (SiC) option is also available for further increased switching frequency and efficiency.