Mouser Electronics has now started stocking the Molex’s Mirror Mezz connectors which will offer data rates up to 56Gbps per differential pair. With this data rate, the footprint-compatible, hermaphroditic mezzanine connector solution will is ideal for space-constrained application areas such as networking, 5G communications, server applications and storage applications. It also features a Stitched Ball grid Array (BGA) design that offers more cost savings than previous insert-molded BGA attachments. The connectors will also offer high-temperature thermoplastic housing with operating temperature range from -550C to +1050C.
The connectors comes with cutting-edge electrical features for fast speeds and an intricately designed terminal structure provides various mechanical strengths. The connectors has 1000MΩ insulation resistance with 30 mΩ low-level contact resistance for 5mm stack height. It offers dielectric withstand (hipot) of 500 VDC with impedance of 92Ω and can carry maximum voltage of 30 VAC with 1A maximum current per contact.
To learn more, go to www.mouser.com/molex-mirror-mezz-connectors.