Microchip Technology Inc. has announced the release of a new hybrid power drive module for electric aviation applications. The module is the first variant of a new product line of power devices that will be available in 12 different variants with either silicon carbide (SiC) MOSFETs or insulated-gate bipolar transistors (IGBTs).
Designed to meet the needs for an integrated and configurable power solution for aviation, these hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. They include a three-bridge topology that are available in SiC or Si semiconductor technologies, and offer a compact design and low weight and profile, helping reduce the size and weight of More Electric Aircraft (MEA).
Other key capabilities of these hybrid power drive modules include numerous auxiliary power devices for an inrush current limit function and optional add-on capabilities such as soft start, solenoid interface drive, regenerative brake switch and thermal sensors for external monitoring circuitry usage. The modules also facilitate high-switching frequency power generation, enabling smaller and more efficient systems. The standard voltage of the modules ranges from 650V to 1200V, with the option to customize up to 1700V on request.
"Microchip is committed to developing products that serve as the building block to implement lighter, more compact and highly efficient system solutions in aviation,” said Leon Gross, corporate vice president of Microchip’s discrete power management business unit. “The hybrid power drive modules deliver a comprehensive power solution for our customers who are designing More Electric Aircraft.”
The hybrid power drive module is available for order in production quantities. For pricing and more information, contact a Microchip sales representative or authorized worldwide distributor.