Infineon Technologies and Schweizer Electronic are collaborating to develop a way to embed Infineon’s 1200 V CoolSiC chips directly onto printed circuit boards (PCB), in order to increase the efficiency of chips based on silicon carbide. This move is aimed at increasing the range of electric vehicles and reducing overall system costs. By embedding a 48 V MOSFET in the PCB, both companies have already demonstrated a 35% increase in performance, with Schweizer contributing to this success through its innovative p²Pack® solution.
The low-inductive environment of a PCB enables fast and clean switching, which, when combined with the performance of 1200 V CoolSiC™ devices, can enable highly integrated and efficient inverters, according to Robert Hermann, Product Line Head Automotive High-Voltage Discretes and Chips at Infineon. Meanwhile, Thomas Gottwald, Vice President Technology at Schweizer Electronic AG, said that the fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack, leading to increased efficiency and improved reliability of power conversion units.