Infineon and ROHM have signed an MoU(Memorandum of Understanding) that lets them act as second sources for each other's customers using certain SiC products with applications including electric vehicle on-board chargers, solar photovoltaic systems, energy storage, and AI data centres. This will make both the design and procurement process easier for the customer. The standardisation of packages means that customer designs can integrate solutions from either company.
The agreement stipulates that ROHM will incorporate Infineon's top-side cooling packages, including TOLT, D-DPAK, Q-DPAK, Q-DPAK dual, and H-DPAK. The upside to Infineon’s top-side cooling platform is that all packages share a height of 2.3mm, which simplifies design, reduces cooling costs, and achieves up to double the power density. On Infineon’s part, they will develop a compatible package using the SiC half-bridge configuration of ROHM’s DOT-247. These will help add to Infineon’s Double TO-247 IGBT family. ROHM’s DOT-247 takes away some of the assembly effort while delivering a higher power density. The configuration combines two TO-247 packages and offers a rough 15% reduction in thermal resistance and 50% reduction in inductance when compared to the TO-247. The result of the combination is 2 times the size and 2.3 times the power density.
In the future, the companies plan to partner up on other packages as well, with both silicon and wide-bandgap semiconductor materials. This will leave the customers with more sourcing options and build stronger ties between the companies. Dr. Peter Wawer, Division President Green Industrial Power at Infineon, said, "Our collaboration will provide customers with a wider range of options and greater flexibility in their design and procurement processes, enabling them to develop more energy-efficient applications that will further drive decarbonization." Dr. Kazuhide Ino, Member of the Board, Managing Executive Officer, in charge of Power Devices Business at ROHM, also shared the enthusiasm: "By working together, we can drive innovation, reduce complexity and increase customer satisfaction, ultimately shaping the future of the power electronics industry."
