onsemi has announced a trio of silicon carbide (SiC) based power modules in transfer molded technology that are intended for use in on-board charging and high voltage (HV) DCDC conversion within all types of electric vehicles (xEV). The new APM32 series is the first of its kind that adopts SiC technology into a transfer molded package to enhance efficiency and shorten charge time of xEVs and is specifically designed for high-power 11-22kW on-board chargers (OBC). All three modules are housed in a compact and robust Dual Inline Package (DIP), which ensures low module resistance. The top cool and isolated features meet the most stringent automotive industry standards.
Two modules of the APM32 series, NVXK2TR40WXT and NVXK2TR80WDT, are configured in H-bridge topology with a breakdown (V(BR)DSS) capability of 1200 V, ensuring suitability for high voltage battery stacks. They are designed to be used in the OBC and HV DCDC conversion stages. The third module, NVXK2KR80WDT, is configured in Vienna Rectifier topology and used in the power factor correction (PFC) stage of the OBC. There will be six-pack and full-bridge modules in the near future to complete the SiC OBC portfolio.
Each of the three modules exhibits low conduction and switching losses, combined with best-in-class thermal resistance and high voltage isolation to deal with 800V bus voltage. The enhanced efficiency and lower heat generation ultimately allow for a more powerful OBC. Taking advantage of onsemi’s end-to-end SiC supply chain capability and proven SiC MOSFETs and diodes, the APM32 modules offer high levels of reliability, and each module is serialized for full traceability. Moreover, these modules can operate with junction temperatures (Tj) as high as 175°C, ensuring reliability even in challenging, space-constrained automotive applications.