Investment

Cyient Semiconductors Announces Kinetic Acquisition Deal Cyient Semiconductors Announces Agreement to Acquire Controlling Stake in Kinetic Technologies

Cyient Semiconductors has entered into an agreement to acquire a controlling stake in Kinetic Technologies. Expected to close in the months ahead, the acquisition can involve a transaction of up to $93 million. The existing leadership and engineering team within Kinetic Technologies will continue operating within their current structure, while synchronizing with Cyient Semiconductors' strategy…

SFO Plans Major Electronics Facility in Theni SFO Technologies to Set Up Greenfield Electronics Facility in Theni, Tamil Nadu

NeST Group’s flagship company, SFO Technologies, exchanged a memorandum of understanding (MoU) with the Tamil Nadu government at the TN Rising Conclave in Madurai. The MoU is for its plans to establish a greenfield electronics manufacturing facility in Theni, Tamil Nadu. The exchange happened in the presence of Chief Minister M.K. Stalin and Industries Minister Dr T.R.B. Rajaa.

The…

AEIM’s ₹10,000-Crore Semiconductor Materials Facility AEIM’s ₹10,000-Crore Semiconductor Materials Facility at Nava Raipur Underway

Chennai-based company Artificial Electronics Intelligent Materials Limited (AEIM) has been allotted 11.28 acres of land in Kosala Industrial Park by the Nava Raipur Atal Nagar Vikas Pradhikaran (NRDA). Construction of a multi-storey semiconductor materials facility will begin immediately, using post-tensioned slab technology, which allows for quicker construction cycles through means such as…

Nirmala Sitharaman Visits Tata Electronics’ OSAT Centre In Assam Nirmala Sitharaman Visits Tata’s Rs 27,000 Crore OSAT Project in Assam

Nirmala Sitharaman visited Tata Electronics’ Outsourced Semiconductor Assembly and Test (OSAT) Centre that’s currently under development in Jagiroad, Assam. During her visit, she highlighted the promise that Assam shows and encouraged students and entrepreneurs to be part of its technological journey. She also praised the state’s foresight and proactive approach, noting the significance of the…

Foxconn Commits ₹15,000 Crore Tamil Nadu Expansion Foxconn’s Rs 15,000 Crore Commitment in Tamil Nadu to Create 14,000 Jobs

Foxconn has made an investment commitment of Rs 15,000 crore in Tamil Nadu, which is expected to create 14,000 high-value engineering jobs. The company’s plans include value-added manufacturing, AI-driven operations, and R&D integration. India’s first Foxconn Desk will be launched by the Guidance nodal agency, which will help facilitate the company’s domestic setup. This announcement comes…

India Approves Four Semiconductor Projects India Approves Four New Semiconductor Projects Worth ₹4,600 Crore Across Three States

The Union Cabinet has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM). The combined investments amount to ₹4,600 crore. Proposals came from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.

These facilities are expected to employ 2,034 skilled…

Lenskart Invests in Ajna Lens for Smart Glasses Development Lenskart Invests in Ajna Lens Targeting the Growing Smart Glasses Sector

Lenskart has invested in Ajna Lens, a Mumbai-based deep-tech startup. Founded in 2014, Ajna Lens builds AI-powered XR (Extended Reality) glasses. The combination of tech they use includes spatial computing, AI vision, and XR stack. Their customers include enterprise, education, and defence sectors for whom they create immersive tools for use cases like virtual training, simulations, and…

Kaynes Ships First Chip Prototype to AOS Kaynes Becomes First OSAT to Ship Prototype Under India’s Semiconductor Mission

According to a Business Standard report (as republished by Communications Today), Kaynes Semicon will deliver a prototype of a chip to its very first paying customer, Alpha & Omega Semiconductor (AOS), who will test it to ensure it works as required before full production gets approved. This means the prototype will go through an approximately three-month qualification process that…

Raphe mPhibr Secures $100 Million Funding Raphe mPhibr Raises $100 Million in India’s Largest Private Funding Round in Aerospace and Defence Sectors

An Indian defence and aerospace startup, Raphe mPhibr, has raised $100 million in a new private funding round, which was the largest ever in India’s aerospace and defence sector. With this, the company’s total funding stands at $145 million. The money will go towards expanding aircraft design, engineering, and manufacturing facilities.

Raphe mPhibr develops UAVs, including the mR10,…

Motherson Reports 5X Aerospace Growth, Ventures Into Semiconductors Auto Giant Motherson Enters Chip Equipment Market After 5X Aerospace Boom

Samvardhana Motherson International Ltd (SAMIL) has expanded in the aerospace sector, quite noticeably in fact. The company reported a fivefold growth in a year. In the company’s Q4 FY25 earnings call, it was disclosed that SAMIL’s aerospace revenue went up from ₹339 crore in FY24 to ₹1,749 crore in FY25. Confirming its status as a Tier-1 supplier to Airbus, it is now entering the…

Hiranandani Group Announces Massive Semiconductor Project Hiranandani Group Announces Rs 28,440 Crore Semiconductor Project in Noida

The Hiranandani Group, popularly known as a real estate company, has unveiled a Rs 28,440 crore investment towards semiconductor manufacturing. During the Invest UP roundtable held on May 27, 2025, at Mumbai’s Jio World Convention Centre, the announcement was made alongside a lot of other significant ones. Commitments adding up to around Rs 69,000 crore were made across different sectors in…

TSMC Plans Munich Centre to Support Chip Design TSMC Brings Advanced Chip Design to Munich as Europe Chases AI Edge

Plans to establish a chip design centre in Munich, Germany, were announced by TSMC, the world’s largest contract semiconductor foundry. The new facility is intended to support European clients in developing high-performance, high-density, and energy-efficient integrated circuits.

According to Paul de Bot, President of TSMC Europe, the Munich Design Centre intends to focus on design…