Tata Electronics Expresses Interests to Enter into Packaging of Semiconductor Components

Published  May 9, 2022   0
S Staff
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Semiconductor-Packaging

Tata Electronics has expressed its interest in four states; Odisha, Karnataka, Telangana, and Tamil Nadu as they think they are the perfect locations for setting up the facility

Raja Manickam, who is spearheading the Outsourced Semiconductor Assembly and Test (OSAT) wing of Tata Electronics, has told the media that the company intends to enter into packaging of cutting-edge semiconductor components for which they are in discussions with various international giant semiconductor firms and OSAT vendors. The vendors of OSAT are involved in offering test services and third-party Integrated Circuit-packaging. 

To carry out the same, Tata Electronics has expressed its interest in four states; Odisha, Karnataka, Telangana, and Tamil Nadu as they think they are the perfect locations for setting up the facility. In the Hosur city of Tamil Nadu, the company has already commenced an operational center. Manickam, who was previously leading Tessolve Semiconductors, has told ET, “We've written up a report on pros and cons in all the four states. Hopefully, by mid-May, we'll make an announcement on location. We have not finalized or signed up with any of them yet but we will get into advanced packaging for sure.”

Manickam also proclaimed that Tata Electronics was casting around for the entire market for having a technology associate for top-notch packaging and not the conventional one. Basically, conventional packaging involves high-volume business for which the company thinks they don’t require a partner and can craft it themselves. Sophisticated packaging of semiconductor components helps semiconductor firms to amalgamate cutting-edge and advanced chips into an integrated system for applications that require both types, which also reduce costs. 

This course is dubbed as heterogeneous integration that allows firms to merge numerous diminutive chips rather than manufacturing one large chip. This is because bigger chips have lower productivity with the drop typically scaling with chip size. Therefore, in this scenario, heterogeneous integration is helpful for scaling down costs. A year back, N Chandrasekharan, the Chairman of Tata Sons stated that the global Tata Group aims to enter into semiconductor manufacturing.

t the annual general meeting of the IMC Chamber of Commerce and Industry, Chandrasekharan Said "At the Tata group, we have already pivoted into a number of new businesses like electronics manufacturing, 5G network equipment as well as semiconductors.