RRP Electronics Partners with Deca Technologies to Boost Semiconductor Packaging in India

Published  January 17, 2025   0
Rajendra K. Chodankar, CEO of RRP Electronics

RRP Electronics, backed by cricket legend Sachin Tendulkar has partnered with Deca Technologies, a US-based leader in semiconductor packaging. This collaboration aims to strengthen India’s semiconductor manufacturing capabilities by integrating Deca's Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into RRP Electronics operations. Under this strategic partnership, RRP Electronics has signed a Technology Transfer License Agreement with Deca Technologies. Rajendra K. Chodankar, CEO of RRP Electronics stated that the agreement grants exclusive rights to adopt Deca’s advanced semiconductor packaging technologies. The first phase of the collaboration will focus on setting up fully automated facilities designed to enhance production quality and efficiency. Operations are expected to begin by August 2025, after completing the necessary qualification tests.

RRP Electronics is already working on the production of sophisticated Application-Specific Integrated Circuits (ASICs) in QFN packages for a Swiss customer. The company’s semiconductor initiatives are being developed at an Outsourced Semiconductor Assembly and Testing (OSAT) facility in Maharashtra with an investment of ₹24000 crore. This facility is expected to generate over 4000 jobs, contributing to domestic employment and skill development. The infrastructure features ISO-certified cleanrooms and follows strict energy-efficient and environmentally friendly practices.

The company’s project is divided into three phases with the Phase One focused on establishing a packaging facility, which began operations in August 2024. Phase Two involved setting up a pilot fab, successfully completed in December 2024. Phase Three will focus on enhancing design strengths and expanding project capabilities. RRP Electronics plans to improve its design flexibility and take on new projects in collaboration with Deca Technologies, further broadening its operational scope.

Through this partnership, RRP Electronics aims to achieve a revenue target of ₹260 crore within the second year of operations. This initiative aligns with the Indian government’s efforts to establish the country as a global hub for semiconductor manufacturing. Tim Olson, CEO of Deca Technologies, stated that this partnership would enable RRP Electronics to grow rapidly while contributing to the global semiconductor market. The collaboration is expected to play a key role in strengthening India’s semiconductor ecosystem and addressing the growing demand for advanced electronic components.