Paras Defence and Space Technologies has announced a ₹6,200 crore investment through its subsidiary Paras Semiconductors Pvt. Ltd. to establish a greenfield advanced semiconductor packaging facility in Madhya Pradesh. The project marks the company’s expansion into the semiconductor packaging segment alongside its existing defence and space-related operations.
The company said the proposed facility will focus on advanced semiconductor packaging capabilities, including outsourced semiconductor assembly and test (OSAT) and assembly, testing, marking and packaging (ATMP) activities. Paras Defence said the investment will be made through Paras Semiconductors Pvt. Ltd., which will undertake the semiconductor packaging project.
The announcement did not disclose details on the project’s construction timeline, investment deployment schedule, financing arrangements, government approvals, customer agreements, or expected revenue contribution. Paras Defence has not provided further details on the operational capacity or commissioning date of the proposed facility.
