onsemi has announced a series of new MOSFET devices that feature innovative top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. These devices deliver the electrical efficiency required in high-power applications with RDS(ON) values as low as 1mΩ and target applications are high/medium power motor controls such as electric power steering and oil pumps.
Housed in a TCPAK57 package measuring just 5mm x 7mm, these devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Moreover, the improved reliability of the new design adds to an overall extended system lifetime.
This solution leverages onsemi’s deep expertise in packaging to provide the highest power density solution in the industry. TCPAK57 initial portfolio includes 40V, 60V and 80V and all devices are capable of operating at junction temperatures (Tj) of 175°C and are AEC-Q101 qualified and PPAP capable. This, along with their gull wings that allow inspection of solder joints and superior board-level reliability, makes them ideally suited to demanding automotive applications.