The MoU is on five fronts, viz. semiconductor design, manufacturing, equipment research, talent development, and bringing resilience to the semiconductor supply chain
In a further effort to boost the semiconductor industry in the country, India has now inked an agreement with Japan in terms of talent development, design, equipment research, and manufacturing. The union minister of Electronics & Information Technology, Ashwini Vaishnaw has told the media that the MoU is an imperative strategy to craft a sturdy value chain.
During the media interaction, the minister said, “The MoU is on five fronts, viz. semiconductor design, manufacturing, equipment research, talent development, and bringing resilience to the semiconductor supply chain.” He further mentioned that the important agreements like the current one with Japan and the Critical and Emerging Technology (iCET) initiative with the US offered a crystal-clear strategic assistance when industries from these nations engage in discussions.
Experts have added that it is now very clear that the government’s strategy is centered around growing the industrial sectors in India by associating with Japan, US, or any other country. During the media briefing, it was also revealed that some discussions are still going on to sign another MoU with Japanese semiconductor firm Rapidus. In India, the semiconductor industry is now seeing immense growth, which has exceeded $650 million and is anticipated to reach $1 billion in the coming five to six years.
Now, in an effort to fulfill the demand, a massive talented and skilled workforce and huge growth at numerous locations are needed. After the anti-China sentiments and USA’s export ban strategy on China, Japan is eyeing India as the most trustworthy partner. Apart from that, the minister mostly focussed on advanced packaging. This is because according to him, the entire semiconductor development depends on advanced packaging technology at various levels.
The major strength of India is its design potential with over 50 plus designs and thus, it makes the country an impeccable choice for semiconductor manufacturing. In order to have more talent and skilled workforce for the packaging sector, India has signed agreements with Georgia Tech University and already signed one with Caldwell University in the US.