Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centres, 5G and AI

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ByRajni Setia 0

 PM6200 META-DX2L Ethernet PHY

Microchip’s PM6200 META-DX2L is a multi-purpose low-power PHY (physical layer) solution that enables routers, switches, and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates. The compact device supports up to 1.6 Tbps capacity in retiming applications and up to 800G capacity in the gearbox and 2:1 mux applications.

PM6200 META-DX2L solution reduces power per port by 35% as compared to its 56G PAM4 predecessor, META-DX1. The device features 32 SerDes, a hitless 2:1 mux, a flexible crosspoint, and support for additional protocols, such as Fibre Channel and OTN. The high availability architectures and the device latency enable Class C/D PTP at the system level.

The SerDes of this device can support backplanes and passive Direct Attach (DAC) cables at up to 112 Gbps and can also be configured to reduce power for VSR applications. The device is suitable to be used as a fabric card in a modular switch/router system, line card in a modular switch/router system, fixed form factor switch/router, AI acceleration nodes, and compact optical transport platform.

Key Features of the PM6200 META-DX2L

  • Dual 800 GbE, Quad 400 GbE, and 16x 100/50/25/10/1 GbE PHY

  • Supports Ethernet, OTN, and Fibre Channel data rates

  • Supports proprietary data rates for AI/ML applications

  • Integrated 2:1 hitless mux enables high availability/protection architectures

  • Highly configurable crosspoint supporting multi-rate services on any port

  • Constant latency, enabling IEEE 1588 Class C/D PTP at the system level

  • FEC termination, monitoring, and conversion between various interface rates

  • 32 long-reach (LR) capable 112G PAM4 SerDes with programmability to optimize power vs. performance

  • Support for DAC cables, including auto-negotiation and link training

  • Industrial-temperature-range support, enabling deployments in outdoor environments

  • Complete Software Development Kit (SDK) with the hitless upgrade and warm restart capabilities and compatible with the field-proven META-DX1 SDK

META-DX2L devices available in compact package size, 23 x 30 millimeter (mm) are expected to sample during the fourth quarter of this year.  

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