CDIL Semiconductors and Infineon Technologies Asia Pacific Pte Ltd have signed a Memorandum of Understanding to explore strategic collaboration opportunities in India’s fast-growing semiconductor market. The agreement aims to leverage CDIL’s six decades of expertise in semiconductor packaging and Infineon’s global leadership in power systems and IoT. This partnership supports India’s semiconductor self-reliance goals and strengthens the domestic supply chain while addressing evolving market needs with significant potential globally.
Under the agreement, Infineon will supply high-performance bare die wafers, which CDIL will package into discrete and module semiconductor products designed for Indian customers. The collaboration combines Infineon’s advanced wafer technology with CDIL’s 60 years of packaging expertise. This integrated approach offers a cost-optimized, domestically produced supply and delivers reliable, energy-efficient solutions with reduced lead times, reinforcing India’s domestic capabilities and enhancing its position in the global semiconductor value chain, benefiting the nation’s economic growth.
CDIL President Pankaj Gulati stated that the collaboration is a strong endorsement of India’s potential in power semiconductor manufacturing, highlighting the integration of world-class wafer technology with advanced OSAT capabilities. Infineon’s Senior Vice President Richard Kuncic said that the partnership will drive innovation and deliver advanced power semiconductor products, addressing growing demands in e-mobility, renewable energy and energy-efficient appliances across India. Both executives emphasized that the initiative strengthens technological progress and supports India’s national agenda.
Together, CDIL and Infineon will target key industries such as automotive and mobility, renewable energy and industrial as well as consumer applications. The collaboration aligns with the government’s focus on semiconductor self-reliance by reducing import dependency and promoting domestic production. This joint effort sets a solid foundation for future innovation, deeper technological engagement and sustainable growth in India’s semiconductor ecosystem.
