Advanced Imaging Radar Sensing Solution from NXP forms 360-degree Safety Cocoon around Vehicles to Address NCAP Requirements

Published  December 8, 2020   0
Radar Sensing Chipset Solutions from NXP Semiconductors

The new radar sensing chipset solutions from NXP Semiconductors enables designers to form a 360-degree safety cocoon around vehicles and address NCAP requirements for corner and front radar applications. This new solution comprises of 77GHz transceivers and radar processors and can not only measure the range and speed of objects but can also use its 4D-Imaging radar to measure direction, angle of arrival, and elevation measurement. This radar IP is based on volume-proven advanced process technologies and can provide a scalable portfolio approach for optimum design and software re-use, further it can also reduce R&D effort and deliver faster time to market.  

The new suite of radar sensing solutions comprises of S32R294 processor, the S32R45 processor, and the TEF82xx transceiver family. The purpose-built S32R45 radar processor and the TEF82xx transceivers together deliver a finer angular resolution, processing power, and range required to distinguish between small objects in the distance, and to separate and classify vehicles and vulnerable road users like cyclists or pedestrians in crowded environments with high accuracy.

These radar sensing chipset solutions target cost-effective and small footprint NCAP corner radar requirements for high volume vehicle production. It also provides scalability for long-range front radar and advanced multi-mode use cases like simultaneous blind-spot detection, lane change assistance, and elevation sensing. The S32R294 radar processors combined with its TEF82xx transceivers provide a scalable solution that helps carmakers address NCAP and advanced corner radar as well as long-range front radar sensor requirements in an effective way while allowing tailoring for individual use cases.

NXP Radar Sensor Solutions are built on market-leading and volume-proven 16nm FinFET and 40nm RFCMOS technology. The samples are already out and mass production is scheduled to start in 2021.