high power density
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Infineon sets new power benchmark for AI accelerators and vertical power delivery with 2 A/mm² dual-phase smart power stages Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation AI accelerators and vertical power delivery modules. Integrating Infineon's OptiMOS™ 6 MOSFETs and a dual-phase driver IC in a compact 6 x 6 x 0.8 mm³ package… |
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Vishay Intertechnology’s Thin Film High Frequency Chip Resistors Deliver More Power in Less Space, Without Need for a Heatsink Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of thin film chip resistors in compact 0402 and 0603 case sizes. Built on an advanced aluminum nitride (AlN) substrate, the Vishay Sfernice CHEP series combines exceptional power handling and high frequency performance in standard surface-mount footprints, allowing designers to achieve higher… |
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New CoolSiC MOSFETs 650 V G2 in TOLT and Thin-TOLL Package Increase System Power Density Infineon Technologies AG has expanded its portfolio of CoolSiC MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages. They are based on the CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and… |
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EconoDUAL 3 Portfolio Enhanced with New Current Ratings for Increased Power Density and Performance Infineon Technologies has enhanced its 1200 V EconoDUAL 3 portfolio with the TRENCHSTOP IGBT7 chip by offering new current ratings from 300 A to 900 A. The broad range of current offers inverter designers a high degree of flexibility along with increased power density and performance. Featuring new current ratings, these new devices are suitable to be used in solar, drive… |
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New surface mount inductors to meet complex requirements of today’s high power density
TT Electronics announced two new surface mount device (SMD) power inductors: the HM66M series for use in high frequency power conversion systems and EMI filter applications, and the HM78M series for use in high density and high frequency DC/DC converter applications.
The TT… |
