To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Texas Instruments introduced two new isolated CAN flexible data rate (FD) transceivers that combine high bus fault protection,…
Toshiba announced the launch of TCB702FNG, an addition to its 4-channel high-efficiency linear power amplifiers that meet…
Maxim’s new isolated RS-485 module transceiver with power - MAXM22511 simplifies and shrinks the design of field bus…
STMicroelectronics released two new microcontrollers STM32L412 and STM32L422 with a focused feature set and compact size, to…
Texas Instruments released the industry's first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor…
Texas Instruments announced a new portfolio of ready-to-use, 600-V gallium nitride (GaN), 50-mΩ and 70-mΩ power stages to…
The LSM6DSO iNEMO™ Inertial Measurement Unit (IMU) from STMicroelectronics is an always-on 3D accelerometer and 3D gyroscope…
Texas Instruments introduced a new temperature sensor family that offers ±0.1°C accuracy across a wide temperature range and…
Now engineers designing into applications in factory automation, medical, communications and consumer markets can tap into four…
Sensirion announced its new humidity and temperature sensor module, the SCC30-DB, that can be placed anywhere in a device and…
Minimizing power consumption in portable electronics devices is a top priority for product designers. In order to meet the…
Silicon Labs released new LTE-M expansion kit featuring Digi XBee3™ pre-certified cellular modem to provide ultra-low-power,…
