X-class image sensor platform permits the camera design to enable not only multiple product resolutions but also the different pixel functionality.
The first devices in the image sensor platform are the 12 megapixels (MP) XGS 12000 and 4k / UHD resolution XGS 8000 image sensors. It allows high-performance imaging ability for various application like machine vision, intelligent transportation systems, and broadcast imaging. It supports Different pixel architectures through common high bandwidth and low power interface. Different pixel functionality like larger pixels that trade resolutions at a particular optical format for higher image sensitivity.
XGS 12000 and XGS 8000 are the available devices of X-Class family to be deployed in this platform, based on first-pixel architecture. The new XGS 12000 delivers 12MP of resolution in 1-inch optical format to feed the imaging details and performance needed for modern machine vision and inspection application.
Two-speed grades are planes for XGS 12000:
- One that utilizes 10GigE interfaces by providing full resolution speed up to 90 frames per second.
- The lower price version provides 27 fps at full resolution
XGS 8000 provides 4k/UHD (4096*2160) resolution in a 1/1.1 inch optical format and designed to provide two-speed grades of 130 and 75fps which makes the device ideal for broadcast application.
“As the needs of industrial imaging applications such as machine vision inspection and industrial automation continue to advance, the design and performance of the image sensors targeting this growing market must continue to evolve,” said Herb Erhardt, Vice President and General Manager, Industrial Solutions Division, Image Sensor Group at ON Semiconductor.
“With the X-Class platform and devices based on the new XGS pixel, end users have access to the performance and imaging capabilities they need for these applications, while camera manufacturers have the flexibility they require to develop next-generation camera designs for their customers both today and in the future.”
Both the device package works on low-voltage and low power architecture of the X-Class interface to make them fully compatible with small size of 29*29mm2 camera design. Both the devices available in 163-pin LGA packages in monochrome and color configuration by the second quarter of 2018.
